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EPD/OES

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OPTI Series
반도체/디스플레이 제조 공정 챔버 내부의 Plasma를 분광 분석법으로 분석하여 공정의 종료점을 자동 검출하거나 공정의 변화 상태를 모니터링하는 센서
 
This is our EPD(End Point Detection)/OES(Optical Emission Spectroscopy) solution designed for detecting endpoint and monitor process state change in the semiconductor and display manufacturing using plasma spectroscopy technology.


 
특장점

√ 낮은 가격 !  최고의 성능 !
√ 고객 요구 사항에 따른 최적의 모델 제안 및 신속한 커스터마이징
√ 안정적인 시스템 구조 및 데이터 처리 방식
√ 다양한 공정 적용 경험 및 노하우

 


Customer Benefits

√ Control the process accurately and stably
√ Improve production yield-rate
√ Respose to the changes of process promptly
√ Available optimized solution for H/W or S/W to detect an endpoint

 


Application

√ End Point Detection, Process fault Detection
√ Dry etcher/Asher/PECVD @Semiconductor/display manufacturing
√ Increase throughput by determining the optimal etch time
√ Detect process endpoint through in-situ monitoring optical change in the plasma chamber

 


Features

√ In-situ monitoring for 200~850nm
√ Use highly sensitive CCD sensor(2,048pixels)
√ Advanced EPD algorithms : Differential threshold method, Window method

 


Operating Principles
Specification
Category
Item
Description
Composition Detectors / Controller 1~ 7ch, Max.12 (Available More Addition)
Optic CCD Sensor 2048 pixels / 16bits
Spectral Range 200~850nm (UV to NIR)
Optical Resolution <±0.5nm
Integration Time Min. 7ms
Scan Time (Interval Time) Min. 50ms
Optical Fiber SMA905 type Connector, 4m
Condensing Lens Module (Optional)
Electric Power Requirement 0.8A/12VAC
Operation Operating System Windows XP, Windows7
Software AOS (AEGIS Operating Software)
Communication Ethernet
RS232, Digital I/O (Optional)
Protocol TCP/IP, SECS, SECSII/GEM, SSCP
Possible to modify and develop by customer’s request
Mechanic Material (Body) Anodized Aluminum
Dimension 103(W) x 54(H) x 137(D) mm
Weight ~1.2kg
Viewport Interface Optionally Provided According to Customer’s Request or Equipment
Model
  1. Detector
 
    광학 해상도, 시스템 구조에 따른 최적 모델 제안 !!!
사진 설명
OPTI-L20 (standard type)
- 1D CCD (2048pixels)
- S/N Ratio 250:1
OPTI-L10 BT
- 2D CCD (2048*64pixels)
- S/N Ratio 450:1
- Enhanced Sensitivity(especially at UV range)
OPTI-PLUS
- for Etch Process
- Local Controller at Each Chamber
- Distributed Processing for Minimizing Risk of System Down
  2. Controller
 
    √ 설치환경, 고객 기호에 따른 최적 모델 제안 !!!
사진 설명
SMC-10 (standard type)
- Horizontal Type
- 3U 19” rack mount type
SMC-10H (I)
- Vertical Type
- Keyboard, Mouse, Monitor all in one type
SMC-10H (II)
- Vertical Type
- with Work Table & Monitor Arm
Application
  1. Wafer PR ashing & Al etching
- PR ashing (CO peak wavelength)
- Single wafer type, Mass run
- Al etching (Al peak wavelength)
- Wafer #10 batch type, Mass run
  2. α-si LCD Process
Endpoint detection at the following processes
 
_ Active _ Passivation
_ PR strip
  3. Wafer multi-layer etching
  4. LCD 4-mask multi-step